Electroformed Nickel, Inc.


ELECTROFORMED NICKEL, INC. is a privately owned small business formed to satisfy the unique requirements of today's highly technical industries. Founded in 1981 and incorporated in 1985, ENI has gained international recognition as the premier company operating in the field of heavy electro-deposition of metals and alloys. The success that we have enjoyed is the result of a carefully nurtured exchange of ideas with our customers, enabling us to produce durable and attractive products of high quality and marketability. Our customer register ranges from small and medium sized companies to several of the world's largest corporations. A sampling of our commercial product line includes such items as: molds, stamping dies, holographic replications, and optical or Fresnel reproductions. Many of the electroforms fabricated at ENI are one-of-a-kind items that represent advanced concepts in this particular manufacturing discipline. We expanded our operations to include electrodeposited alloys for structural applications, electrodeposited OFHC copper for high thermal and electrical conductivity. Our processes have been developed by personnel with accumulative experience of more than one hundred years. Many processes used were developed through research on SBIR, or the unique requirements of high tech industry.



Services



A brief description of the metals and alloys that have been electrodeposited here at Electroformed Nickel are provided. Please browse the list to determine whether we routinely produce a metal that will qualify for your requirements.

STRUCTURAL ELECTROFORMING FOR ENGINEERING APPLICATIONS :

Nickel Electroformed - nickel is produced from the sulfamate electrolyte. Typical mechanical properties for engineering applications meet the following range:

  • Ultimate Strength, Ksi 90 to 120
  • Yield Strength, Ksi 60 to 80
  • Elongation, % 10 to 20

Specific mechanical properties in the above range can be met and maintained over a great deposit thickness (ENI has electrodeposited nickel in thickness exceeding one inch).

  • For improved weldability, sulfur is maintained below 20 ppm. Residual stress is generally less than 4 Ksi tensile, however, stress can be reduced to near neutral values for specific applications.
  • Brightening, leveling and stress reducing additives are not employed in Electroformed Nickel's structural electrolytes, unless specifically requested to meet special optical or hardness requirements.

Nickel / Cobalt - An alloy of nickel/cobalt is used when high strength is required and the alloy will not be exposed to temperatures exceeding 450 degrees farenheight (232 degrees celsius). Nickel/Cobalt may be deposited in cobalt percentages from 3 to 55. Mechanical properties vary with percentage of cobalt.


Copper - We have the ability to deposit copper with a wide range of mechanical properties based on the application of the product. Copper may be deposited with relatively high tensile properties for structural applications or very high purity (OFHC) for electrical or thermal conductivity.


Typical analysis for high purity (OFHC) copper meets the following limitations:

  • Oxygen less than 10 ppm
  • Hydrogen less than 5 ppm
  • Nitrogen less than 15 ppm
  • Sulfur less than 18 ppm

As deposited, mechanical properties of the high purity copper may be varied over a wide range as follows:

  • Ultimate Strength, Ksi 32 to 55
  • Yield Strength, Ksi 16 to 35
  • Elongation, % 20 to 40

Mechanical properties of electroformed copper can be maintained over a very great thickness based on our ability to maintain microstructural grain size and uniformity.


ENI electroforms copper components that exceed ten square feet of surface area. Cylindrical parts are submerged in the electrolyte and rotated in a horizontal attitude to prevent porosity from gases generated by the process.


Should your company have special applications for hostile environment operations, please contact us for a personal evaluation.



INSTALLATION AND TRAINING


As many of our customers expand their operations to include captive facilities for production of security and/or novelty holographic stamper plates, security printing plates, injection molds, and embossing plates for silver jewelry, ENI personnel designed and installed facilities tailored to the unique needs of individual companies. As a leaders in the electroforming industry, our management staff has held national office and has been recognized by "The American Electroplaters and Surface Finishers Society" for contributions for the advancement of electroforming techniques. We have also been granted the US Small Business Administration's Administrator's Award for Excellence.


If your firm is considering expansion to include electroforming operations, why not take advantage of our vast experience. As a complete electroforming company, we offer:

  • The equipment necessary for electroforming.
  • Turnkey facility installation.
  • On-site training at your facility for management and technical personnel.
  • Consulting services for electroform development projects.
  • On-going support in the maintenance of facility operations.


Confidentiality and security are a priority with us. We participate in non-disclosure agreements. We have an excellent history of customer satisfaction and service. Our clients have always found us available to meet all of their facility requirements, either by telephone or scheduled visits, years after equipment has been installed. Why not contact us today and let one of our professionals assist you with your development of new products or processes to improve your competitiveness?



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